Advances in Interconnect Technologies: An International Journal (AITIJ) invites original and significant contributions relating to the theory, design, performance and reliability of interconnect, including materials, analysis, modeling and simulation of interconnect. The journal proposes to stimulate the development of latest technology in industry and academia. High quality review papers and short communications are also acceptable.

• Emerging Materials
• CNT/ Graphene Interconnects
• Modeling and Simulation
• Testing
• RFIC
• Optical Interconnects
• Wireless Interconnects
• Microstrip Lines
• Analog and Mixed Signals
• Dedicated Software and Systems for Developing Interconnect Technology
• On-Chip and Off-Chip Interconnects
• EMC/EMI
• FPGA/ASICs
• Fabrication Techniques
• Neural Networks
• Parasitics Issues
• Optimization Techniques

• Submission Deadline : September 17, 2022
• Notification : October 17, 2022
• Final Manuscript Due : October 17, 2022
• Publication Date : Determined by the Editor-in-Chief